Solder Ball Market Manufacturers, Trend, Growth, Share, Countries and Future Forecast Report 2025

Solder Ball Market is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules. The Solder Ball can be placed manually or by automated equipment, and are held in place with a tacky flux. Solder Ball are very small spheres of high-purity solder for micro soldering system. The most important advantages of Solder Ball are their very clean surfaces and exact solder quantity control. Most suitable for Ball Grid Array, Multi-Chip Module, Chip On board Flip Chip and CSP.

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This report focuses on the Solder Ball in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.
Asia Pacific held the leading share of the market in terms of revenue in 2016. We estimate that the global market share of Solder Ball is 27.66% in Taiwan, 20.54% in Korea, 17.28% in Japan, 15% in China and 10.56% in South East Asia. Because there are many larger IC packaging (including testing) companies in these region, such as ASE, Amkor, SPIL etc. Solder Ball are most suitable for Ball Grid Array, Multi-Chip Module, Chip On board Flip Chip and CSP.

Complete report on Solder Ball Industry report spread across 135 pages, profiling 9 companies and supported with tables and figures available @ https://www.orianresearch.com/enquiry-before-buying/577721 .

Senju Metal, DS HiMetal and MKE captured the top three revenue share spots in the Solder Ball market in 2016. Senju Metal dominated with 40.00% revenue share, followed by DS HiMetal with 19.14% revenue share and MKE with 7.08% revenue share.

The worldwide market for Solder Ball is expected to grow at a CAGR of roughly 6.6% over the next five years, will reach 310 million US$ in 2023, from 210 million US$ in 2017, according to a new study.

Solder Ball Market Segment by Manufacturers:
Senju Metal
DS HiMetal
MKE
YCTC
Nippon Micrometal
Accurus
PMTC
Shanghai hiking solder material
Shenmao Technology

Market Segment by Type, covers:
Lead Solder Ball
Lead Free Solder Ball

Market Segment by Applications, can be divided into:
BGA
CSP & WLCSP
Flip-Chip & Others

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There are 15 Chapters to deeply display the global Solder Ball Market.

Chapter 1: Describe Solder Ball Introduction, product scope, market overview, market opportunities, market risk, and market driving force.

Chapter 2: Analyze the top manufacturers of Solder Ball, with sales, revenue, and price of Solder Ball, in 2015 and 2017.

Chapter 3: Display the competitive situation among the top manufacturers, with sales, revenue and market share in 2015 and 2017.

Chapter 4: Show the global market by regions, with sales, revenue and market share of Solder Ball, for each region, from 2011 to 2017.

Chapter 5, 6, 7, 8 and 9: Analyze and talked about the key regions, with sales, revenue and market share by key countries in these regions.

Chapter 10 and 11: Show the market by type and application, with sales market share and growth rate by type, application, from 2011 to 2017.

Chapter 12: In Chapter Eleven Solder Ball market forecast, by regions, type and application, with sales and revenue, from 2017 to 2025.

Chapter 13, 14 and 15: Describe Solder Ball sales channel, distributors, traders, dealers, appendix and data source.

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