Collaborative Research on High-Resolution Laser-PEEM for Semiconductor Applications

Hitachi High-Tech and the University of Tokyo are conducting joint research to commercialize high-resolution Laser-PEEM for semiconductor manufacturing. The research will be presented at MNC 2024. Laser-PEEM enables faster imaging compared to conventional SEM, allowing for non-destructive observation of material chemistry and nanostructures.

Key findings include:
1. Faster Nanoscopic Imaging – Laser-PEEM captures broad, high-resolution images efficiently, reducing inspection time compared to SEM.
2. Chemical Information Visualization – It enables direct observation of latent patterns in semiconductor processing, improving defect detection and yield.
3. Non-Destructive 3D Defect Analysis – Laser-PEEM can inspect defects without physical cross-sectioning, crucial for next-gen 3D semiconductor structures.

Hitachi High-Tech aims to integrate automation and stabilization technologies with the University of Tokyo’s high-resolution innovations, applying Laser-PEEM to semiconductor metrology and beyond, addressing broader industrial and scientific challenges.